5SGSMD3E3H29I3LN

IC FPGA 360 I/O 780HBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
F93856-DS
Manufacturer
Manufacturer Part #
5SGSMD3E3H29I3LN

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47 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-HBGA (33x33)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O360
Number of L A Bs/ C L Bs89000
Number of Logic Elements/ Cells236000
Total R A M Bits13312000
SeriesStratix® V GS
Base Product Number5SGSMD3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGSMD3E3H29I3LN is an IC component manufactured by Intel. It belongs to the Stratix V series, which is a family of field-programmable gate arrays (FPGAs) widely used in a variety of applications such as high-performance computing, telecom, industrial automation, and aerospace. Key features of the 5SGSMD3E3H29I3LN include: 1. High-Performance FPGA: It is built on a 28nm process technology, offering a high level of performance, speed, and reliability. 2. Logic Capacity: The 5SGSMD3E3H29I3LN features a large logic capacity, with approximately 290,000 equivalent logic elements (LEs). This makes it suitable for complex and computation-intensive designs. 3. Multi-Core Processing: The IC component supports up to 36 processor cores, allowing for parallel processing and efficient execution of multiple tasks simultaneously. 4. Transceiver Technology: It incorporates advanced transceiver technology, providing high-speed serial connectivity up to 12.5 Gbps. This makes it suitable for applications requiring high data bandwidth, such as data centers and high-speed communication systems. 5. Memory: The component includes dedicated memory blocks to facilitate efficient data storage and retrieval. It supports various types of memories, such as RAM, ROM, and FIFO buffers

In Stock: 47

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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