5SGSMD3E3H29I3L

IC FPGA 360 I/O 780HBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
B19A00-DS
Manufacturer
Manufacturer Part #
5SGSMD3E3H29I3L

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

28 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-HBGA (33x33)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O360
Number of L A Bs/ C L Bs89000
Number of Logic Elements/ Cells236000
Total R A M Bits13312000
SeriesStratix® V GS
Base Product Number5SGSMD3
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for 5SGSMD3E3H29I3L.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGSMD3E3H29I3L is a high-performance integrated circuit (IC) component manufactured by Intel. This field-programmable gate array (FPGA) chip belongs to the Arria 10 family and offers advanced features and capabilities for a wide range of applications. Here are the key features of the 5SGSMD3E3H29I3L FPGA component: 1. FPGA Architecture: The 5SGSMD3E3H29I3L utilizes Intel's 20 nm process technology and leverages a high-performance architecture that includes programmable logic blocks, embedded multipliers, and various digital signal processing (DSP) elements. This enables efficient and flexible implementation of complex digital circuits. 2. Logic Capacity: With a static random-access memory (SRAM) capacity of 1,416,768 logic elements (LEs), this FPGA offers ample resources for developing sophisticated designs. These LEs can be customized to implement different logical functions as per the application requirements. 3. High-Speed Interfaces: The 5SGSMD3E3H29I3L supports several advanced communication protocols and interfaces. It includes transceivers with data rates up to 10.3125 Gbps, allowing for high-speed data transmission. Additionally, it provides support for numerous protocols like PCIe Gen3 x8, 10Gb Ethernet, JESD204B, and more

In Stock: 28

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04