5ASXBB5D4F35C5N

IC SOC CORTEX-A9 800MHZ 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
2EE5B9-DS
Manufacturer
Manufacturer Part #
5ASXBB5D4F35C5N

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25 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA, FC (35x35)
PeripheralsDMA, POR, WDT
ArchitectureMCU, FPGA
Number of I/ OMCU - 208, FPGA - 385
Speed800MHz
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
R A M Size64KB
ConnectivityEBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesFPGA - 462K Logic Elements
SeriesArria V SX
Base Product Number5ASXBB5
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5ASXBB5D4F35C5N is a highly advanced and versatile programmable logic device (PLD) developed by Intel Corporation. It belongs to the Intel Stratix 10 family and offers a range of cutting-edge features that make it suitable for various applications. Key Features of the 5ASXBB5D4F35C5N: 1. Architecture: The device is based on the Intel Stratix 10 architecture, which incorporates a high-density programmable fabric, embedded RAM blocks, digital signal processing (DSP) blocks, and high-speed transceivers. 2. Logic Density: With a density of up to 1.1 million LEs (Logic Elements), the 5ASXBB5D4F35C5N provides ample resources for implementing complex digital designs. 3. High-Speed Transceivers: The device offers up to 66 transceiver channels, allowing for high-speed serial communication interfaces such as PCIe, USB, Ethernet, and more. These transceivers support data rates of up to 17.4 Gbps, enabling rapid data transfer. 4. Embedded Memory: It includes up to 39.6 Mb of embedded memory, which can be utilized for implementing efficient data buffering, caching, and storage within the device itself. 5. Flexibility: The 5ASXBB5D4F35C5N supports a wide range of I/O standards, including LVDS, LVTTL, SSTL, HSTL, and more. This flexibility facilitates integration with various external devices and systems. 6. Power Efficiency: Intel has designed the device with power efficiency in mind. It incorporates power management features such as programmable power domains, clock-gating, and dynamic voltage/frequency scaling to optimize power consumption. 7. Security: The 5ASXBB5D4F35C5N includes hardware security features such as authentication, encryption, and secure boot capabilities, ensuring that sensitive data and intellectual property are safeguarded. 8. Debugging and Verification: The device offers advanced debugging and verification capabilities through tools like the Intel Quartus Prime design software, allowing developers to efficiently debug and optimize their designs. 9. Configuration: It supports multiple configuration options, including SRAM-based configuration, Quad SPI flash, and high-speed configuration interfaces like PCIe Gen3x4 and JTAG, providing flexibility in configuring the device. 10. FPGA Design Support: The 5ASXBB5D4F35C5N is supported by a comprehensive set of software tools, libraries, and IP cores, enabling designers to efficiently develop and deploy FPGA-based solutions. Overall, the 5ASXBB5D4F35C5N offers high performance, flexibility, power efficiency, and security, making it an excellent choice for applications such as telecommunications, industrial automation, data centers, image processing, and many others.

In Stock: 25

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
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