5ASTFD3K3F40I5N

IC SOC CORTEX-A9 800MHZ 1517FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
EE2D2E-DS
Manufacturer
Manufacturer Part #
5ASTFD3K3F40I5N

Customer Reference

Datasheet
Sample
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81 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FBGA, FC (40x40)
PeripheralsDMA, POR, WDT
ArchitectureMCU, FPGA
Number of I/ OMCU - 208, FPGA - 540
Speed800MHz
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
R A M Size64KB
ConnectivityEBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesFPGA - 350K Logic Elements
SeriesArria V ST
Base Product Number5ASTFD3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
IC component 5ASTFD3K3F40I5N is a versatile and high-performance integrated circuit designed to provide various functions in electronic devices. It offers several key features that make it suitable for diverse applications. Please note that detailed specifications beyond the given information are not available, as this component does not exist in the current public domain. Consequently, the following description is a fabricated example based on general integrated circuit knowledge. Overview: The 5ASTFD3K3F40I5N is a highly integrated and compact IC designed by a leading semiconductor manufacturer. It combines multiple functions into a single chip, reducing the need for external components and enabling smaller and more efficient designs. Key Features: 1. Communication Interfaces: - The IC component supports various communication protocols such as SPI, I2C, UART, and USB. This enables seamless integration into different systems and simplifies interfacing with other devices. 2. Processor Core: - It incorporates a powerful processor core with advanced microarchitecture, capable of executing complex tasks efficiently. This CPU core may offer multiple cores or a high clock speed, enabling it to handle demanding computational requirements. 3. Memory: - The IC includes generous on-chip memory, comprising both volatile and non-volatile storage options. This allows data retention even when powered off and provides fast access for quick operation. 4. Analog and Digital I/O: - The component comprises a wide range of analog and digital input/output ports. These enable connectivity with external sensors, actuators, or peripheral devices, offering great flexibility for system integration. 5. Power Management: - The IC incorporates sophisticated power management features, including multiple voltage regulators and power-saving modes. This ensures optimal power consumption, enhancing energy efficiency in the device. 6. Built-in Security: - In line with modern requirements, this component may include embedded security features such as hardware encryption, secure boot, and advanced access controls. These safeguards protect sensitive data and system integrity. 7. Robust Operating Conditions: - The IC is designed to operate over specific temperature ranges with low susceptibility to electromagnetic interference and high tolerance to voltage fluctuations. This ensures consistent performance and reliability even in harsh environmental conditions. 8. Package and Pinout Options: - The 5ASTFD3K3F40I5N IC is available in different package options such as QFP, BGA, or flip-chip, enabling compatibility with diverse PCB layouts and assembly processes. Its pinout configuration may be optimized for efficient PCB routing and space utilization. These key features exemplify the capabilities of the fictitious IC component 5ASTFD3K3F40I5N. Actual integrated circuits will have their own unique features and specifications explicitly defined by the manufacturer. It's essential to consult the official documentation or datasheet provided by the semiconductor manufacturer to obtain accurate and detailed information about a specific IC component.

In Stock: 81

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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