5AGXMA7D4F27C4N

IC FPGA 336 I/O 672FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
77F02E-DS
Manufacturer
Manufacturer Part #
5AGXMA7D4F27C4N

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67 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
672-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case672-BBGA, FCBGA
Supplier Device Package672-FBGA (27x27)
Voltage - Supply1.07V ~ 1.13V
Number of I/ O336
Number of L A Bs/ C L Bs11460
Number of Logic Elements/ Cells242000
Total R A M Bits15470592
SeriesArria V GX
Base Product Number5AGXMA7
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5AGXMA7D4F27C4N is an advanced integrated circuit (IC) component manufactured by Intel. It belongs to the Arria 10 GX family, which is specifically designed for high-performance applications requiring high-speed processing and massive computational capabilities. This IC offers a wide range of key features that make it suitable for various applications in industries like telecommunications, aerospace, defense, and finance. Here is an overview of the key features of the 5AGXMA7D4F27C4N: 1. FPGA Technology: The IC incorporates a Field-Programmable Gate Array (FPGA), which allows users to configure the chip's functionality based on their specific requirements. It provides flexibility, enabling customization and adapting to evolving needs without requiring costly hardware changes. 2. High Performance: The 5AGXMA7D4F27C4N offers a high-performance computing system with a maximum core frequency of 450 MHz. It includes high-speed transceivers capable of supporting data rates up to 10 Gbps, enabling fast communication between devices or systems. 3. Logic and DSP Resources: This IC features a significant number of versatile logic elements and digital signal processing (DSP) blocks. The logic elements can be utilized for general-purpose computing tasks, while the DSP blocks are optimized for numerical calculations and signal processing algorithms. 4. Memory Interfaces: The chip provides support for various memory interfaces, including DDR4, DDR3, and LPDDR3

In Stock: 67

MOQ
1PCS
Packaging
672-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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