10AS066H3F34E2SG

IC SOC CORTEX-A9 1.5GHZ 1152FBGA
part number has RoHS
1 : $7304.8800

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Dasenic Part Number
1EE26F-DS
Manufacturer
Manufacturer Part #
10AS066H3F34E2SG

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1123 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray
Quantity
Unit Price
$ 7304.88
Total
$ 7304.88

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerIntel Corporation
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature0°C ~ 100°C (TJ)
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA, FC (35x35)
PeripheralsDMA, POR, WDT
ArchitectureMCU, FPGA
Number of I/ O492
Speed1.5GHz
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
R A M Size256KB
ConnectivityEBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesFPGA - 660K Logic Elements
SeriesArria 10 SX
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN3A001A7B
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The 10AS066H3F34E2SG is an advanced Integrated Circuit (IC) component manufactured by a company. This IC offers high performance and functionality, making it suitable for various electronic applications. Here are some key features of the 10AS066H3F34E2SG: 1. Integration: The IC is highly integrated, containing numerous components and functionalities on a single chip. This integration helps to reduce the overall size and complexity of the circuit design, making it more efficient and cost-effective. 2. Field-Programmable Gate Array (FPGA) Technology: The 10AS066H3F34E2SG is based on FPGA technology, allowing users to configure and reconfigure the chip's logic circuits according to their specific requirements. This flexibility makes it suitable for applications that require dynamic and customizable behavior. 3. Advanced Processing Power: The IC offers powerful processing capabilities, enabling it to handle complex algorithms and tasks. This makes it suitable for applications that require high computational power, such as image processing, digital signal processing, and artificial intelligence. 4. High-Speed Interfaces: The 10AS066H3F34E2SG provides support for various high-speed interfaces, including PCIe (Peripheral Component Interconnect Express), Ethernet, USB (Universal Serial Bus), and more. These interfaces allow for fast and reliable data transfer, making it suitable for applications that demand high bandwidth and low latency. 5. On-Chip Memory: The IC incorporates on-chip memory, both volatile (RAM - Random Access Memory) and non-volatile (Flash memory). This integrated memory helps to accelerate data processing and reduces the need for external memory components, further enhancing the overall performance of the circuit. 6. Secure and Reliable Operation: The IC includes advanced security and reliability features to protect sensitive data and ensure the proper functioning of the device. These features may include encryption/decryption capabilities, error detection and correction mechanisms, and built-in self-test functionalities. 7. Low Power Consumption: The 10AS066H3F34E2SG is designed to operate efficiently with low power consumption. This feature is crucial for battery-powered devices or applications where power efficiency is vital, helping to extend battery life and reduce energy costs. 8. Development Tools and Support: The IC is supported by comprehensive development tools and documentation, including software development kits, programming languages, and technical support. This facilitates the design process and enables developers to quickly prototype and deploy their applications. Overall, the 10AS066H3F34E2SG is a highly integrated, powerful, and versatile IC component that offers advanced features and functionalities. Its FPGA architecture, high-speed interfaces, on-chip memory, security features, and low power consumption make it suitable for a wide range of applications, including communication systems, industrial automation, high-performance computing, and more.

In Stock: 1123

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 7304.88
Total
$ 7304.88

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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