XCZU19EG-2FFVD1760I

IC SOC CORTEX-A53 1760FCBGA
part number has RoHS
1 : $22852.5000

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Dasenic Part Number
4683B3-DS
Manufacturer
Manufacturer Part #
XCZU19EG-2FFVD1760I

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1794 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FCBGA (42.5x42.5)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O308
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU19
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU19EG-2FFVD1760I is an advanced integrated circuit (IC) component designed by Xilinx. It is a versatile device that combines high-performance processing capabilities with programmable logic, making it suitable for a wide range of applications. Here is an overview of its key features: 1. Processing Power: The XCZU19EG-2FFVD1760I is built around the Xilinx Zynq UltraScale+ MPSoC architecture, which integrates a powerful quad-core Arm Cortex-A53 processor, a dual-core Arm Cortex-R5 real-time processor, and a Mali-400 MP2 GPU. This combination delivers exceptional processing power for demanding applications. 2. Programmable Logic: One of the main advantages of this IC component is its programmable logic, which allows users to implement custom hardware accelerators and optimize their designs. It features a large programmable logic capacity, with a generous supply of programmable logic cells, flip-flops, and block RAM resources. 3. High-Speed Interfaces: To facilitate connectivity and data transfer, the XCZU19EG-2FFVD1760I offers a variety of high-speed interfaces. It includes multiple Gigabit Ethernet ports, PCIe Gen3 interfaces, USB 3.0 ports, SATA interfaces, and numerous high-speed transceivers operating at speeds up to 16 Gbps. 4. FPGA Fabric: The device incorporates a highly flexible field-programmable gate array (FPGA) fabric that enables the implementation of complex digital designs. The FPGA fabric supports a wide range of IP cores and has the ability to reconfigure on-the-fly, allowing for dynamic hardware updates and system modifications. 5. Memory and Storage: To support data-intensive applications, the XCZU19EG-2FFVD1760I is equipped with a comprehensive selection of memory and storage options. It includes a large amount of on-chip memory, DDR4 memory interfaces, NAND and NOR flash interfaces, and Quad-SPI interfaces. 6. High-Speed SerDes: The IC component features a set of high-speed transceivers that can operate at data rates up to 32.75 Gbps. These transceivers are well-suited for implementing high-bandwidth protocols like PCIe, HDMI, DisplayPort, and more. 7. Security Features: Xilinx has incorporated various security features into the XCZU19EG-2FFVD1760I to ensure the protection of sensitive data and system integrity. These features include secure boot, encrypted bitstream programming, tamper detection, and fault isolation mechanisms. 8. System Integration: The device offers extensive system integration capabilities, enabling seamless connectivity with other system components. It includes dedicated interconnects for peripheral and memory interfaces, support for AMBA AXI and AHB protocols, and multiple high-bandwidth interconnects for efficient data movement. 9. Development Tools: Xilinx provides a comprehensive suite of development tools and software libraries to aid designers in harnessing the full potential of the XCZU19EG-2FFVD1760I. These tools include the Vivado Design Suite, SDK, and PetaLinux, allowing developers to design, validate, and deploy their applications efficiently. In conclusion, the XCZU19EG-2FFVD1760I stands as a high-performance integrated circuit component featuring a powerful processing subsystem, reconfigurable FPGA fabric, extensive interface options, and robust security features. Its versatility and programmability make it an excellent choice for diverse applications in sectors like communications, industrial automation, aerospace, and more.

In Stock: 1794

MOQ
1PCS
Packaging
1760-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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