XCZU17EG-2FFVB1517E

IC SOC CORTEX-A53 1517FCBGA
part number has RoHS
1 : $13650.0000

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Dasenic Part Number
B95FBB-DS
Manufacturer
Manufacturer Part #
XCZU17EG-2FFVB1517E

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1162 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature0°C ~ 100°C (TJ)
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FCBGA (40x40)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O644
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 926K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU17
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU17EG-2FFVB1517E is an integrated circuit (IC) component manufactured by Xilinx. It belongs to the Zynq UltraScale+ family and is specifically designed for applications that require high-performance processing, programmable logic, and high-speed connectivity. Key features of the XCZU17EG-2FFVB1517E include: 1. UltraScale+ Architecture: The IC is built on the UltraScale+ architecture, which combines the benefits of FPGA (Field-Programmable Gate Array) and SoC (System-on-Chip) technologies. This enables the integration of processing subsystems, programmable logic, and various peripherals on a single chip. 2. Processing Capabilities: The XCZU17EG-2FFVB1517E is equipped with a powerful processing system consisting of a quad-core Arm Cortex-A53 processor and dual-core Arm Cortex-R5 processor. It also includes a GPU (Graphics Processing Unit) for advanced graphics applications. 3. Programmable Logic: The IC incorporates a programmable logic fabric, which allows users to implement custom digital circuits and algorithms tailored to their specific requirements. The fabric consists of configurable logic blocks (CLBs), DSP (Digital Signal Processing) slices, and memory blocks. 4. High-Speed Interfaces: To facilitate high-speed communication, the XCZU17EG-2FFVB1517E provides a range of interfaces such as Gigabit Ethernet, USB (Universal Serial Bus) 3.0, PCIe (Peripheral Component Interconnect Express) Gen4, and DisplayPort. These interfaces enable connectivity with external devices and communication with other systems. 5. Memory and Storage: The IC includes various memory components, including DDR4 (Double Data Rate 4) SDRAM, Quad-SPI (Serial Peripheral Interface) flash, and SDIO (Secure Digital Input Output) controllers. These enable efficient storage and retrieval of data during operation. 6. Security Features: The XCZU17EG-2FFVB1517E includes built-in security features to protect sensitive data and Intellectual Property (IP). It provides mechanisms such as encrypted bitstreams, secure boot, and encrypted memory to ensure secure operation and prevent unauthorized access. 7. Software Development Tools: Xilinx offers a comprehensive suite of software development tools, including Vivado Design Suite and SDK (Software Development Kit). These tools allow developers to design, simulate, and program the XCZU17EG-2FFVB1517E efficiently. 8. Scalability and Flexibility: The XCZU17EG-2FFVB1517E is highly scalable and can be customized to meet specific application requirements. With its programmable logic and processing resources, developers have the flexibility to tailor the chip's functionality and performance as needed. In summary, the XCZU17EG-2FFVB1517E is a powerful IC component that combines processing and programmable logic capabilities. It offers high-speed interfaces, extensive memory, security features, and software development tools, making it suitable for a wide range of applications that demand high-performance processing and programmability.

In Stock: 1162

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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