XCZU11EG-3FFVC1156E

IC SOC CORTEX-A53 1156FCBGA
part number has RoHS
1 : $16072.5000

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Dasenic Part Number
910349-DS
Manufacturer
Manufacturer Part #
XCZU11EG-3FFVC1156E

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2534 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1156-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature0°C ~ 100°C (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1156-FCBGA (35x35)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O360
Speed600MHz, 667MHz, 1.5GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 653K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU11
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU11EG-3FFVC1156E is a high-performance integrated circuit (IC) component that offers a wide range of features and functionalities. Here is an overview and key features of this IC component: 1. High-Performance Processing: The XCZU11EG-3FFVC1156E is based on the Xilinx Zynq UltraScale+ MPSoC architecture, which combines a programmable logic fabric with high-performance ARM processor cores. This allows for flexible and efficient processing of complex tasks and algorithms. 2. FPGA Fabric: The IC component features a highly configurable Field-Programmable Gate Array (FPGA) fabric. This allows users to implement custom digital logic designs and accelerate specific algorithms or functions in hardware for enhanced performance. 3. ARM Cores: The XCZU11EG-3FFVC1156E integrates four ARM Cortex-A53 64-bit processor cores, with a maximum clock speed of 1.2 GHz. These cores offer a balance between high-performance processing and power efficiency, making them suitable for a wide range of applications. 4. Programmability: The IC component is highly programmable, enabling users to configure both the FPGA fabric and the ARM processor cores. This flexibility allows for the implementation of specific functionalities and the optimization of performance according to the requirements of the application. 5. Connectivity: The XCZU11EG-3FFVC1156E offers various connectivity options, including high-speed serial transceivers (up to 16 Gbps), USB ports, Gigabit Ethernet, I2C, UART, and SPI interfaces. These interfaces enable seamless integration with other devices and systems. 6. Memory Interfaces: The IC component supports various memory interfaces, including DDR4 SDRAM, Quad SPI flash memory, and SD/SDIO interfaces. These memory options provide ample storage and data transfer capabilities, ensuring efficient operation of the system. 7. High-Speed I/Os: The XCZU11EG-3FFVC1156E features numerous programmable input/output (I/O) pins that support various I/O standards, including LVCMOS, LVDS, and different high-speed serial standards. This enables the IC component to interface with a wide range of external devices and systems. 8. Security Features: To ensure secure operation, the XCZU11EG-3FFVC1156E includes features such as secure boot, secure key storage, and AES encryption/decryption capabilities. These security measures help protect sensitive data and prevent unauthorized access to the system. 9. Power Management: The IC component incorporates power management features to optimize power consumption and extend battery life in applications that require low power. It enables dynamic voltage and frequency scaling to optimize performance and power usage. 10. Development Ecosystem: Xilinx provides a comprehensive development ecosystem for the XCZU11EG-3FFVC1156E, including software development tools, programming models, and libraries. This ecosystem facilitates the design, development, and deployment of applications on the IC component. In summary, the XCZU11EG-3FFVC1156E is a high-performance IC component that combines FPGA fabric with ARM processor cores. With its flexibility, programmability, connectivity options, and security features, it caters to a wide range of applications that demand high-performance processing and customization capabilities.

In Stock: 2534

MOQ
1PCS
Packaging
1156-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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