XCZU11EG-2FFVC1156I

IC SOC CORTEX-A53 1156FCBGA
part number has RoHS
1 : $13187.5000

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Dasenic Part Number
0AD161-DS
Manufacturer
Manufacturer Part #
XCZU11EG-2FFVC1156I

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969 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1156-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1156-FCBGA (35x35)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O360
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 653K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU11
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU11EG-2FFVC1156I is an IC (integrated circuit) component manufactured by Xilinx. It belongs to the Zynq UltraScale+ family and offers advanced features for various applications. Here is an overview and the key features of the XCZU11EG-2FFVC1156I: 1. Processing System: - The IC component combines an ARM Cortex-A53 64-bit quad-core processor with a dual-core Cortex-R5 real-time processor. - The Cortex-A53 cores operate at up to 1.5 GHz and provide high-performance processing capabilities for Linux and other operating systems. - The Cortex-R5 cores operate at up to 600 MHz and specialize in real-time applications. 2. Programmable Logic: - XCZU11EG-2FFVC1156I offers a programmable logic section consisting of an array of configurable logic blocks (CLBs) and programmable interconnects. - The programmable logic allows users to implement custom digital logic designs, accelerating hardware development and customization. 3. Integrated Memories: - The component integrates various memory types for different purposes, including on-chip RAM, cache memory, and QDMA (Quad Data Rate Memory Controller) interfaces. - The on-chip memory reduces the need for external memory, enhancing overall system performance and reducing costs. 4. High-Speed Interfaces: - The XCZU11EG-2FFVC1156I supports a wide range of high-speed interfaces such as PCIe (PCI Express), USB 3.0, SATA (Serial ATA), and Ethernet. - These interfaces enable the IC to seamlessly communicate with other devices, expand connectivity options, and enhance data transfer rates. 5. Programmable I/O: - The component provides numerous general-purpose I/O (GPIO) pins that can be configured as digital input/output or specialized interfaces (e.g., SPI, I2C, UART, etc.). - The programmable I/Os offer flexibility to connect and control various external devices and provide improved interfacing capabilities. 6. Flexible Packaging: - The XCZU11EG-2FFVC1156I is packaged in a Flip Chip Ball Grid Array (FCBGA) package with a total of 1156 pins. - This packaging technology allows for compact size, improved thermal performance, and increased reliability in demanding environments. 7. Security Features: - Xilinx has incorporated multiple security features in the Zynq UltraScale+ family, including secure boot, anti-tamper, encrypted bitstream programming, and memory encryption. - These features protect against unauthorized access and ensure the integrity and confidentiality of sensitive information. In summary, the XCZU11EG-2FFVC1156I is a versatile IC component with powerful processing capabilities, programmable logic, integrated memories, high-speed interfaces, programmable I/O, secure features, and a compact packaging form. It is suitable for a wide range of applications in areas like automotive, aerospace, defense, industrial automation, and telecommunications, where high performance, flexibility, and security are critical requirements.

In Stock: 969

MOQ
1PCS
Packaging
1156-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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