XCV600-4FG676I

IC FPGA 444 I/O 676FCBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
D42248-DS
Manufacturer
Manufacturer Part #
XCV600-4FG676I

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2773 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
676-BGA

Quantity

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ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Operating Temperature-40??C ~ 100??C (TJ)
Mounting TypeSurface Mount
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Number of Gates661111
Number of I/ O444
Number of L A Bs/ C L Bs3456
Number of Logic Elements/ Cells15552
Total R A M Bits98304
Voltage Supply2.375V ~ 2.625V

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCV600-4FG676I is an advanced integrated circuit (IC) component designed and manufactured by Xilinx. This IC offers a range of powerful features, making it suitable for various applications such as high-performance computing, telecommunications, advanced digital signal processing, and aerospace systems. Below is an overview of the key features of the XCV600-4FG676I: 1. FPGA Architecture: The XCV600-4FG676I utilizes Field Programmable Gate Array (FPGA) technology. This allows the IC to be dynamically configured and reprogrammed, giving it a high level of flexibility and adaptability to specific application requirements. 2. High Capacity: The XCV600-4FG676I has a large capacity with 600,000 logic cells. Logic cells are fundamental building blocks used in digital circuit design, enabling complex operations and data processing. 3. Versatile I/O Interfaces: With 676 input/output (I/O) pins, this IC provides enhanced connectivity options. These I/O pins support a wide array of communication standards, including various voltage levels and protocols, facilitating seamless integration with external devices. 4. High-Speed Performance: The XCV600-4FG676I delivers exceptional performance, thanks to its high clock frequency and parallel processing capabilities. It can handle complex algorithms and data-intensive tasks efficiently. 5. On-Chip Memory Resources: This IC incorporates different types of on-chip memory, including Block RAM (BRAM) and Distributed RAM (DRAM)

In Stock: 2773

MOQ
1PCS
Packaging
676-BGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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