XCV400-5BG560I

IC FPGA 404 I/O 560MBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
33F726-DS
Manufacturer
Manufacturer Part #
XCV400-5BG560I

Customer Reference

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25 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
560-LBGA Exposed Pad, Metal

Quantity

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ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case560-LBGA Exposed Pad, Metal
Supplier Device Package560-MBGA (42.5x42.5)
Voltage - Supply2.375V ~ 2.625V
Number of Gates468252
Number of I/ O404
Number of L A Bs/ C L Bs2400
Number of Logic Elements/ Cells10800
Total R A M Bits81920
SeriesVirtex®
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV400-5BG560I is a high-performance field programmable gate array (FPGA) integrated circuit (IC) developed by Xilinx, a renowned semiconductor company. This IC belongs to the Virtex II Pro XCV400 FPGA family and is known for its versatility and reliability in various electronic applications. Here are some key features and an overview of the XCV400-5BG560I: 1. FPGA Architecture: The XCV400-5BG560I utilizes the Virtex II Pro FPGA architecture, which offers a combination of configurable logic blocks (CLBs), input/output (I/O) blocks, and enhanced features like clock management circuits and embedded block RAMs (BRAMs). 2. Logic Blocks and Interconnects: This IC integrates approximately 40,000 logic cells, allowing users to implement complex digital designs. The device architecture also incorporates a flexible interconnect hierarchy, enabling efficient communication between logic blocks and I/Os. 3. Embedded Resources: The XCV400-5BG560I provides numerous embedded resources to enhance design capabilities. It boasts 18 built-in DSP slices that facilitate the implementation of high-performance digital signal processing algorithms. Additionally, 72Kbits of on-chip block RAMs enable efficient data buffering and storage. 4. I/O Interfaces: This IC features 560 user I/O pins, ensuring seamless integration with external peripheral devices and facilitating data exchange with the surrounding system

In Stock: 25

MOQ
1PCS
Packaging
560-LBGA Exposed Pad, Metal
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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