XCV1000E-7FG900C

IC FPGA 660 I/O 900FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
CCD7E3-DS
Manufacturer
Manufacturer Part #
XCV1000E-7FG900C

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

65 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
900-BBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case900-BBGA
Supplier Device Package900-FBGA (31x31)
Voltage - Supply1.71V ~ 1.89V
Number of Gates1569178
Number of I/ O660
Number of L A Bs/ C L Bs6144
Number of Logic Elements/ Cells27648
Total R A M Bits393216
SeriesVirtex®-E
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for XCV1000E-7FG900C.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV1000E-7FG900C is a highly integrated programmable logic device (PLD) that belongs to the XC9500 family of CoolRunner XPLA3 CPLDs. XCV1000E-7FG900C offers excellent functionality and versatility, making it suitable for a wide range of applications. Key Features of XCV1000E-7FG900C: 1. High-density and High-performance: The XCV1000E-7FG900C has a generous capacity of 1,000 equivalent macrocells. It operates at a frequency of up to 300MHz, allowing for rapid and efficient processing of complex digital designs. 2. In-system Programmability: The PLD can be reprogrammed in-system, enabling easy and convenient updates of the design without needing to remove or replace the IC component. This feature facilitates faster development, prototyping, and debugging. 3. Low Power Consumption: XCV1000E-7FG900C incorporates advanced low-power technology, consuming minimal power during operation. This is particularly advantageous for battery-powered applications or instances where power efficiency is essential. 4. Flexible I/O Options: The IC component offers a wide range of input and output (I/O) options, including several dedicated I/O banks that can accommodate different voltage standards simultaneously. It also supports various I/O standards, such as LVTTL, LVCMOS, and HSTL, providing compatibility with different interfaces

In Stock: 65

MOQ
1PCS
Packaging
900-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04