XCV1000-6BG560C

IC FPGA 404 I/O 560MBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
C0E326-DS
Manufacturer
Manufacturer Part #
XCV1000-6BG560C

Customer Reference

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43 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
560-LBGA Exposed Pad, Metal

Quantity

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ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case560-LBGA Exposed Pad, Metal
Supplier Device Package560-MBGA (42.5x42.5)
Voltage - Supply2.375V ~ 2.625V
Number of Gates1124022
Number of I/ O404
Number of L A Bs/ C L Bs6144
Number of Logic Elements/ Cells27648
Total R A M Bits131072
SeriesVirtex®
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV1000-6BG560C is a high-performance IC component manufactured by Xilinx. It is a Field-Programmable Gate Array (FPGA) that offers a wide range of features suitable for various applications. Some of the key features of the XCV1000-6BG560C include: 1. Density: The XCV1000-6BG560C has a large capacity with 1,000,000 system gates, making it suitable for complex digital designs. 2. Speed: It operates at a maximum frequency of 185 MHz, enabling fast and efficient processing. 3. Programmability: As an FPGA, the XCV1000-6BG560C can be customized and reprogrammed after manufacturing, allowing users to implement their own logic functions. 4. Embedded Memory: It includes 360 kilobits of embedded memory, providing storage space for data and instructions. 5. Package: The XCV1000-6BG560C is housed in a Ball Grid Array (BGA) package, which offers a high level of reliability and compactness. 6. Power Efficiency: This IC component is designed to be power-efficient, ensuring optimal performance while minimizing energy consumption. 7. I/O Ports: It features a wide range of I/O options, including 316 I/O pins, which can be used for communication with external devices

In Stock: 43

MOQ
1PCS
Packaging
560-LBGA Exposed Pad, Metal
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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