XCV1000-4BG560C

IC FPGA 404 I/O 560MBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
D75F11-DS
Manufacturer
Manufacturer Part #
XCV1000-4BG560C

Customer Reference

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36 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
560-LBGA Exposed Pad, Metal

Quantity

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ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case560-LBGA Exposed Pad, Metal
Supplier Device Package560-MBGA (42.5x42.5)
Voltage - Supply2.375V ~ 2.625V
Number of Gates1124022
Number of I/ O404
Number of L A Bs/ C L Bs6144
Number of Logic Elements/ Cells27648
Total R A M Bits131072
SeriesVirtex®
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV1000-4BG560C is a versatile and high-performance integrated circuit (IC) component designed by Xilinx. It belongs to the Virtex series of field-programmable gate arrays (FPGAs) and offers an array of features and capabilities. Let's explore the key features of this IC component in detail. 1. High-Density and Scalable Design: The XCV1000-4BG560C is based on the Virtex architecture, which enables a high-density design with a large number of programmable logic cells and configurable I/Os. This makes it suitable for complex system-on-chip (SoC) designs. 2. Advanced Process Technology: Built using advanced 0.15-micron CMOS process technology, this FPGA delivers high performance while maintaining low power consumption. The process technology also ensures excellent noise immunity, making it suitable for diverse applications. 3. Programmable Logic Cells: The XCV1000-4BG560C contains a large number of configurable logic blocks (CLBs) or logic cells. These logic cells can be programmed to implement a wide range of combinational and sequential logic functions, providing flexibility in system design. 4. Embedded RAM and DSP Blocks: This IC component incorporates dedicated embedded random-access memory (RAM) blocks and digital signal processing (DSP) blocks. The embedded RAM can be used for storing data, while the DSP blocks aid in implementing complex mathematical operations efficiently

In Stock: 36

MOQ
1PCS
Packaging
560-LBGA Exposed Pad, Metal
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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