The XCKU115-3FLVB1760E is a highly versatile and advanced IC (integrated circuit) component manufactured by Xilinx. It belongs to the Xilinx Kintex UltraScale+ family and is known for its exceptional performance and wide range of features. Here is an overview of this IC component and its key features:
1. FPGA Architecture: XCKU115-3FLVB1760E is a field-programmable gate array (FPGA) that offers a flexible and reconfigurable hardware platform for various applications. It incorporates advanced UltraScale+ architecture that provides a significant leap in processing power and efficiency.
2. Resources: It has a generous capacity with 1,143,000 logic cells, which enables the implementation of complex digital designs. Additionally, it offers 2,520 DSP (digital signal processing) slices for high-performance arithmetic operations and 10,800 Kb of block RAM for data storage.
3. High-Speed Interfaces: The IC component includes multiple high-speed serial transceivers, supporting various protocols such as PCIe Gen4, 100Gb Ethernet, and Interlaken. These interfaces enable fast data transfer rates and facilitate integration with other devices.
4. Memory Interface: XCKU115-3FLVB1760E provides versatile memory options, including DDR4 and DDR3 SDRAM interfaces. These interfaces support high-speed external memories for caching and buffering purposes
