XC3S400-5FG456C

IC FPGA 264 I/O 456FBGA
part number has RoHS
1 : $322.4000

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Dasenic Part Number
5A1A9D-DS
Manufacturer
Manufacturer Part #
XC3S400-5FG456C

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1795 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
456-BBGA
Quantity
Unit Price
$ 322.4
Total
$ 322.4

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusActive
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case456-BBGA
Supplier Device Package456-FBGA (23x23)
Voltage - Supply1.14V ~ 1.26V
Number of Gates400000
Number of I/ O264
Number of L A Bs/ C L Bs896
Number of Logic Elements/ Cells8064
Total R A M Bits294912
SeriesSpartan®-3
PackagingBulk

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusREACH is not affected
US ECCNEAR99
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XC3S400-5FG456C is an integrated circuit (IC) component belonging to the Spartan-3 field-programmable gate array (FPGA) family. It is designed and manufactured by Xilinx, a renowned semiconductor company. This FPGA is widely used in various applications such as automotive, consumer electronics, telecommunications, and industrial control systems. Let's delve into the key features and functionalities of the XC3S400-5FG456C. 1. Spartan-3 Architecture: The XC3S400-5FG456C adopts the Spartan-3 FPGA architecture, which is highly reliable and cost-effective. This architecture provides a comprehensive set of resources and features, making it suitable for a wide range of applications. 2. Gate Density: With an XC3S400 designation, this IC component offers a gate density of 400,000 logic cells. This generous gate count enables the implementation of medium to complex digital designs, empowering engineers to develop intricate systems on a single FPGA chip. 3. Speed Grade: The IC component operates at a speed grade of -5 or 5ns. This indicates that it can perform high-speed operations, making it suitable for demanding applications that require quick response times. 4. Package Type: The XC3S400-5FG456C comes in a FG456 package, which refers to a Fine-Pitch Ball Grid Array (FBGA) with 456 pins

In Stock: 1795

MOQ
1PCS
Packaging
456-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 322.4
Total
$ 322.4

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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