XC3S1500-5FGG456C

IC FPGA 333 I/O 456FBGA
part number has RoHS
1 : $198.9090

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Dasenic Part Number
871B21-DS
Manufacturer
Manufacturer Part #
XC3S1500-5FGG456C

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1576 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
456-BBGA
Quantity
Unit Price
$ 198.909
Total
$ 198.91

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusActive
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case456-BBGA
Supplier Device Package456-FBGA (23x23)
Voltage - Supply1.14V ~ 1.26V
Number of Gates1500000
Number of I/ O333
Number of L A Bs/ C L Bs3328
Number of Logic Elements/ Cells29952
Total R A M Bits589824
SeriesSpartan®-3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusREACH is not affected
US ECCNEAR99
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XC3S1500-5FGG456C is an advanced integrated circuit (IC) component manufactured by Xilinx. It belongs to the Spartan-3 family of Field-Programmable Gate Arrays (FPGAs). With its impressive capabilities and features, it is widely used in various applications, including telecommunications, automotive systems, consumer electronics, and more. Here is an overview of this IC component along with its key features: 1. High Performance: The XC3S1500-5FGG456C is designed to deliver excellent performance with a maximum operating frequency of up to 500 MHz. It consists of around 1.5 million system gates, making it capable of handling complex and demanding tasks efficiently. 2. Abundant Logic Resources: This FPGA offers a generous amount of logic resources, incorporating 1,488 slices and supporting up to 84,480 equivalent Look-Up Tables (LUTs). The availability of abundant logic resources enables designers to implement complex digital designs and algorithms effectively. 3. Flexible I/O Connectivity: With 456 fine-pitch Ball Grid Array (BGA) package pins, the XC3S1500-5FGG456C provides excellent I/O connectivity options. It offers 332 GPIO (General Purpose Input/Output) pins, allowing for versatile connectivity to external devices or peripherals. 4. Memory Options: This IC component features on-chip memory resources to facilitate efficient data storage and retrieval

In Stock: 1576

MOQ
1PCS
Packaging
456-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 198.909
Total
$ 198.91

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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