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Texas Instruments SN74AUP1G07DCKT

Name: SN74AUP1G07DCKT
Brand: Texas Instruments
SKU: SN74AUP1G07DCKT-DS
Price: 0.0956 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 19431

MOQ: 1

7 Price Tiers

Mfr.Part # :SN74AUP1G07DCKT
Manufacturer :Texas Instruments
Dasenic # :SN74AUP1G07DCKT-DS
Datasheet : SN74AUP1G07DCKT Datasheet PDF
Description : Single 0.8-V to 3.6-V low power buffer with open-drain outputs
Package :-
Unit Price: $0.0956
Total: $0.10

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Texas Instruments SN74AUP1G07DCKT technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Buffers, Drivers, Receivers, Transceivers

Product Status:Active

Operating Temperature:-40°C ~ 85°C (TA)

Mounting Type:Surface Mount

Package / Case:5-TSSOP, SC-70-5, SOT-353

Output Type:Open Drain

Supplier Device Package:SC-70-5

Number of Elements:1

Voltage - Supply:0.8V ~ 3.6V

Logic Type:Buffer, Non-Inverting

Number of Bits per Element:1

Current - Output High, Low:-, 4mA

Series:74AUP

Base Product Number:74AUP1G07

Packaging:Tape & Reel (TR)

Packaging:Cut Tape (CT)

Packaging:Dasenic-Reel®

EU RoHS Status:ROHS3 Compliant

MSL Rating:1 (Unlimited, 30°C/85%RH)

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8542.39.0001

China RoHS Status:Green Symbol: Green and environmentally friendly product

SN74AUP1G07DCKT provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.