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Texas Instruments MSP430F2274TDA

Name: MSP430F2274TDA
Brand: Texas Instruments
SKU: MSP430F2274TDA-DS
Price: 6.0660 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 1620

MOQ: 1

8 Price Tiers

Mfr.Part # :MSP430F2274TDA
Manufacturer :Texas Instruments
Dasenic # :MSP430F2274TDA-DS
Datasheet : MSP430F2274TDA Datasheet PDF
Description : 16 MHz MCU with 32KB Flash, 1KB SRAM, 10-bit ADC, 2 OpAmp, I2C/SPI/UART
Package :-
Unit Price: $6.0660
Total: $6.07

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520+	$3.6408	40.0% save
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Texas Instruments MSP430F2274TDA technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules

Product Status:Active

Package / Case:38-TSSOP (0.240, 6.10mm Width)

Peripherals:Brown-out Detect/Reset, POR, PWM, WDT

Speed:16MHz

Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART

Series:MSP430F2xx

Operating Temperature:-40°C ~ 105°C (TA)

Core Processor:MSP430 CPU16

R A M Size:1K x 8

Numberof I/ O:32

Program Memory Type:Flash

Core Size:16-Bit

Data Converters:A/D 12x10b

Oscillator Type:Internal

Program Memory Size:32KB (32K x 8 + 256B)

Voltage- Supply( Vcc/ Vdd):1.8V ~ 3.6V

EU RoHS Status:RoHS Compliant

REACH Status:REACH is not affected

US ECCN:EAR99

China RoHS Status:Green Symbol: Green and environmentally friendly product

MSP430F2274TDA provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.