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Rochester Electronics LPC1766FBD100

In Stock: 8100
MOQ: 8
6 Price Tiers
QuantityUnit PriceYou Save
8+$6.1779-
16+$5.77936.5% save
25+$5.58009.7% save
35+$5.181416.1% save
46+$4.982119.4% save
57+$4.782922.6% save

Rochester Electronics LPC1766FBD100 technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
Product Status:Active
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:100-LQFP
Supplier Device Package:100-LQFP (14x14)
Peripherals:Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number of I/ O:70
Speed:100MHz
E E P R O M Size:-
Core Processor:ARM® Cortex®-M3
R A M Size:64K x 8
Program Memory Type:Flash
Core Size:32-Bit Single-Core
Connectivity:CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Program Memory Size:256KB (256K x 8)
Voltage - Supply ( Vcc/ Vdd):2.4V ~ 3.6V
Data Converters:A/D 8x12b; D/A 1x10b
Oscillator Type:Internal
US ECCN:3A991A2
HTS US:8542.31.0001
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
China RoHS Status:Green Symbol: Green and environmentally friendly product
LPC1766FBD100 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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