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Onsemi FAN7093-F085

Name: FAN7093-F085
Brand: Onsemi
SKU: FAN7093-F085-DS
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 2707

MOQ: 1

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Mfr.Part # :FAN7093-F085
Manufacturer :Onsemi
Dasenic # :FAN7093-F085-DS
Datasheet : FAN7093-F085 Datasheet PDF
Description : IC DRVR HALF BRIDGE PN 8-TO263
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Onsemi FAN7093-F085 technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Full, Half-Bridge Drivers

Product Status:Obsolete

Operating Temperature:-40°C ~ 150°C (TJ)

Features:Latch Function, Slew Rate Controlled, Status Flag

Mounting Type:Surface Mount

Package / Case:TO-263-8, D²Pak (7 Leads + Tab), TO-263CA

Technology:DMOS

Interface:Logic

Supplier Device Package:TO-263-7

Voltage - Supply:7V ~ 18V

Current - Output / Channel:46A

Current - Peak Output:88A

Fault Protection:Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO

Output Configuration:Half Bridge

Load Type:Inductive

Rds On ( Typ):18.2mOhm LS (Max), 12.3mOhm HS (Max)

Voltage - Load:7V ~ 18V

Applications:DC Motors, General Purpose

EU RoHS Status:ROHS3 Compliant

MSL Rating:3 (168 Hours,30°C/60%RH)

REACH Status:REACH Affected

US ECCN:EAR99

HTS US:8542.39.0001

China RoHS Status:Green Symbol: Green and environmentally friendly product

FAN7093-F085 provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.