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Rochester Electronics BCR 141S H6327

Name: BCR 141S H6327
Brand: Rochester Electronics
SKU: BCR 141S H6327-DS
Price: 0.1494 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 529

MOQ: 1

4 Price Tiers

Mfr.Part # :BCR 141S H6327
Manufacturer :Rochester Electronics
Dasenic # :BCR 141S H6327-DS
Datasheet : BCR 141S H6327 Datasheet PDF
Description : BIPOLAR DIGITAL TRANSISTOR
Package :-
Unit Price: $0.1494
Total: $0.15

Quantity	Unit Price	You Save
1+	$0.1494	-
200+	$0.0579	61.2% save
500+	$0.0558	62.7% save
1000+	$0.0548	63.3% save

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Rochester Electronics BCR 141S H6327 technical specifications, attributes, parameters.

Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays, Pre-Biased

Product Status:Active

Mounting Type:Surface Mount

Package / Case:6-VSSOP, SC-88, SOT-363

Power - Max:250mW

Supplier Device Package:PG-SOT363-PO

Transistor Type:2 NPN - Pre-Biased (Dual)

Current - Collector ( Ic) ( Max):100mA

Voltage - Collector Emitter Breakdown ( Max):50V

Vce Saturation ( Max) @ Ib, Ic:300mV @ 500µA, 10mA

Current - Collector Cutoff ( Max):-

D C Current Gain (h F E) ( Min) @ Ic, Vce:50 @ 5mA, 5V

Frequency - Transition:130MHz

Resistor - Base ( R1):22kOhms

Resistor - Emitter Base ( R2):22kOhms

EU RoHS Status:Vendor omitted MSL Rating information

MSL Rating:1 (Unlimited, 30°C/85%RH)

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8541.21.0075

China RoHS Status:Green Symbol: Green and environmentally friendly product

BCR 141S H6327 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.