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Onsemi MC33179DR2G

In Stock: 342767
MOQ: 235
6 Price Tiers
  • Mfr.Part # :MC33179DR2G
  • Manufacturer :Onsemi
  • Dasenic # :MC33179DR2G-DS
  • Datasheet : MC33179DR2G Datasheet PDF
  • Description : IC OPAMP GP 4 CIRCUIT 14SOIC
  • Package :-
  • Unit Price: $0.2037
    Total: $47.87
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Onsemi MC33179DR2G technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Amplifiers - Instrumentation, OP Amps, Buffer Amps
Product Status:Active
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:14-SOIC (0.154", 3.90mm Width)
Current - Supply:1.7mA (x4 Channels)
Output Type:-
Supplier Device Package:14-SOIC
Number of Circuits:4
Amplifier Type:General Purpose
-3db Bandwidth:-
Current - Output / Channel:100 mA
Slew Rate:2V/µs
Gain Bandwidth Product:5 MHz
Current - Input Bias:100 nA
Voltage - Input Offset:150 µV
Voltage - Supply Span ( Min):4 V
Voltage - Supply Span ( Max):36 V
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.33.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
MC33179DR2G provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.

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