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Onsemi MC100EP809MNR4G

Name: MC100EP809MNR4G
Brand: Onsemi
SKU: MC100EP809MNR4G-DS
Price: 8.8023 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 7779

MOQ: 1

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Mfr.Part # :MC100EP809MNR4G
Manufacturer :Onsemi
Dasenic # :MC100EP809MNR4G-DS
Datasheet : MC100EP809MNR4G Datasheet PDF
Description : IC CLK BUFFER 1:9 750MHZ 32QFN
Package :-
Unit Price: $8.8023
Total: $8.80

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Onsemi MC100EP809MNR4G technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Clock Buffers, Drivers

Product Status:Obsolete

Operating Temperature:0°C ~ 85°C

Mounting Type:Surface Mount

Package / Case:32-VFQFN Exposed Pad

Type:Fanout Buffer (Distribution), Multiplexer

Supplier Device Package:32-QFN (5x5)

Frequency - Max:750 MHz

Number of Circuits:2

Output:HSTL

Voltage - Supply:3V ~ 3.6V

Input:HSTL, LVDS, LVPECL

Ratio - Input: Output:1:9

Differential - Input: Output:Yes/Yes

Series:100EP

Base Product Number:MC100EP809

Packaging:Tape & Reel (TR)

MSL Rating:1 (Unlimited, 30°C/85%RH)

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8542.39.0001

EU RoHS Status:RoHS Compliant

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

MC100EP809MNR4G provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.