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Onsemi CNY171W

Name: CNY171W
Brand: Onsemi
SKU: CNY171W-DS
Price: 0.0684 USD
Availability: InStock

In Stock: 1726

MOQ: 1

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Mfr.Part # :CNY171W
Manufacturer :Onsemi
Dasenic # :CNY171W-DS
Datasheet : CNY171W Datasheet PDF
Description : OPTOISO 5.3KV TRANS W/BASE 6DIP
Package :-
Unit Price: $0.0684
Total: $0.07

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Onsemi CNY171W technical specifications, attributes, parameters.

Category:Isolators/Optoisolators - Transistor, Photovoltaic Output

Product Status:Obsolete

Operating Temperature:-55°C ~ 100°C

Mounting Type:Through Hole

Package / Case:6-DIP (0.400", 10.16mm)

Input Type:DC

Output Type:Transistor with Base

Number of Channels:1

Supplier Device Package:6-DIP

Current - Output / Channel:50mA

Voltage - Isolation:5300Vrms

Rise / Fall Time ( Typ):1µs, 2µs

Voltage - Output ( Max):70V

Voltage - Forward ( Vf) ( Typ):1.35V

Current - D C Forward ( If) ( Max):100 mA

Current Transfer Ratio ( Min):40% @ 10mA

Current Transfer Ratio ( Max):80% @ 10mA

Turn On / Turn Off Time ( Typ):2µs, 3µs

Vce Saturation ( Max):300mV

MSL Rating:1 (Unlimited, 30°C/85%RH)

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8541.49.8000

EU RoHS Status:RoHS Compliant

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

CNY171W provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.