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Infineon Technologies XMC1302T028X0128ABXUMA1

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Infineon Technologies XMC1302T028X0128ABXUMA1 technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
Product Status:Active
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package:PG-TSSOP-28-16
Peripherals:Brown-out Detect/Reset, I²S, POR, PWM, WDT
Number of I/ O:26
Speed:32MHz
E E P R O M Size:-
Core Processor:ARM® Cortex®-M0
R A M Size:16K x 8
Program Memory Type:Flash
Core Size:32-Bit Single-Core
Connectivity:I²C, IrDA, SPI, UART/USART
Program Memory Size:128KB (128K x 8)
Voltage - Supply ( Vcc/ Vdd):1.8V ~ 5.5V
Data Converters:A/D 14x12b
Oscillator Type:Internal
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Green Symbol: Green and environmentally friendly product
XMC1302T028X0128ABXUMA1 provided by Infineon Technologies

Infineon Technologies AG (OTCMKTS: IFNNY) is a global semiconductor leader in power systems and IoT.
Infineon drives decarbonization and digitalization with its products and solutions. The company's semiconductor products include ASIC, Battery Management ICs, Clocks & Timing Solutions, ESD and Surge Protection, Memories Microcontroller, RF, Security & smart card solutions, Sensor, Small Signal Transistors & Diodes, Transceivers, Wireless Connectivity, Software, and more. These products are used in automotive, green industrial power, power management, sensing solutions, and security in IoT applications.
Infineon Technologies was founded in 1999 as a spin-off from Siemens AG. The company is headquartered in Neubiberg, near Munich, Germany, and boasts approximately 56,200 employees and 155 locations worldwide.

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