SI7540ADP-T1-GE3

Name: ISL84523IBZ-T
Brand: Renesas Electronics
SKU: EFCA38-DS
Price: 1.341 USD
Availability: InStock

MOSFET N/P-CH POWERPAK8

1 : $1.4670

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Dasenic Part Number

88BCAB-DS

Manufacturer

Vishay Intertechnology

Manufacturer Part #

SI7540ADP-T1-GE3

Customer Reference

Datasheet

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Sample

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11476 In Stock

MOQ

1PCS

Delivery Time

Ship Within 48 Hours

Packaging

PowerPAK® SO-8 Dual Tape & Reel (TR) Cut Tape (CT) Dasenic-Reel®

Quantity

Unit Price

$ 1.467

Total

$ 1.47

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.

Manufacturer	Vishay Intertechnology
Discrete Semiconductor Devices	FETs, MOSFETs
Product Status	Active
Operating Temperature	-55°C ~ 150°C
Mounting Type	Surface Mount
Package / Case	PowerPAK® SO-8 Dual
Power - Max	3.5W
Supplier Device Package	PowerPAK® SO-8 Dual
Configuration	N and P-Channel
Drain to Source Voltage ( Vdss)	20V
Current - Continuous Drain ( Id) @ 25° C	12A, 9A
Rds On ( Max) @ Id, Vgs	28mOhm @ 12A, 10V
Vgs(th) ( Max) @ Id	1.4V @ 250µA
Gate Charge ( Qg) ( Max) @ Vgs	48nC @ 10V
Input Capacitance ( Ciss) ( Max) @ Vds	1310pF @ 10V
Series	TrenchFET®
Base Product Number	SI7540
Packaging	Dasenic-Reel®
Packaging	Cut Tape (CT)
Packaging	Tape & Reel (TR)

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Environmental & Export Classifications

EU RoHS Status	ROHS3 Compliant
MSL Rating	1 (Unlimited, 30°C/85%RH)
US ECCN	EAR99
HTS US	8541.29.0095
REACH Status	REACH is not affected
China RoHS Status	Green Symbol: Green and environmentally friendly product

Description (v) Features

The SI7540ADP-T1-GE3 is a discrete semiconductor component designed for high efficiency applications in power management. It features a low on-resistance (RDS(on)) of 12 mΩ, making it ideal for use in load switches, battery protection circuits, and power supplies. This component is capable of handling up to 40V in a compact PowerPAK SO-8 package, making it suitable for a wide range of applications. The SI7540ADP-T1-GE3 also has a maximum drain current of 40A, ensuring robust performance under high load conditions. Its high power dissipation capability and low thermal resistance contribute to its overall reliability and durability. This discrete semiconductor component offers a cost-effective solution for various power management requirements in industrial, automotive, and consumer electronics applications