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Texas Instruments CD74HC4049EG4

Name: CD74HC4049EG4
Brand: Texas Instruments
SKU: DS-5852295
Price: 0.1582 USD
Availability: InStock
Rating: 4.8 (3 reviews)

IC BUFFER INVERT 6V 16DIP

Manufacturer # :CD74HC4049EG4

Manufacturer :Texas Instruments

Dasenic # :CD74HC4049EG4-DS

Datasheet :

CD74HC4049EG4 Datasheet

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Description : IC BUFFER INVERT 6V 16DIP

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In Stock: 44717

MOQ :1 PCS

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CD74HC4049EG4 information

Texas Instruments CD74HC4049EG4 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
Product Status:Active
Operating Temperature:-55°C ~ 125°C
Mounting Type:Through Hole
Package / Case:16-DIP (0.300", 7.62mm)
Input Type:-
Output Type:Push-Pull
Supplier Device Package:16-PDIP
Number of Elements:6
Voltage - Supply:2V ~ 6V
Logic Type:Buffer, Inverting
Number of Bits per Element:1
Current - Output High, Low:5.2mA, 5.2mA
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments CD74HC4049EG4
Datasheet:
CD74HC4049EG4,

Texas Instruments CD74HC4049EG4 Environmental and export classification status description
The Texas Instruments CD74HC4049EG4 is a high-speed CMOS (Complementary Metal-Oxide-Semiconductor) hex inverter buffer IC. This integrated circuit is part of the HC (High-Speed CMOS) logic family and it is commonly used for signal inversion and buffering operations. Functions: - Inverting logic operations: The CD74HC4049EG4 features six independent inverter buffers that can perform logic inversion on input signals. - Buffering signals: It can also amplify and drive signals, making it useful for interfacing different components in a circuit. Applications: - Signal inversion and buffering in digital circuits. - Level shifting and voltage translation. - Oscillator circuits and signal conditioning. - Noise filtering and waveform shaping. - Communication devices and data transmission systems. Alternative Components: - CD4049UB Hex Inverter Buffer - SN74HC04 Hex Inverter - MC74HC04 Hex Inverter Buffer - CD4093 Quad 2-Input NAND Schmitt Trigger Embedded Modules: As a standalone IC, the CD74HC4049EG4 can be integrated into various embedded systems and electronic devices that require signal inversion and buffering functionalities. It can be used in conjunction with microcontrollers, sensors, and other digital components. Related Q&A: 1. Can the Texas Instruments CD74HC4049EG4 be used to convert voltage levels between different parts of a circuit? 2. How does the performance of the CD74HC4049EG4 compare to other similar CMOS inverter buffer ICs? 3. What are the power supply and voltage requirements for proper operation of the CD74HC4049EG4? 4. In what types of applications is the CD74HC4049EG4 commonly found in electronics projects? 5. Are there any specific layout or decoupling capacitor recommendations for using the CD74HC4049EG4 in a circuit design to ensure optimal performance?

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CD74HC4049EG4 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.