The IC component MPC8247VRMIBA is a versatile and high-performance microprocessor designed by Freescale Semiconductor. This integrated circuit combines a PowerPC core with a wide range of features suitable for various applications. Here is an overview of its key features:
1. PowerPC Core: The MPC8247VRMIBA integrates a powerful PowerPC 603e core, which supports both 32-bit and 64-bit instructions. This core provides excellent performance and is used in many embedded systems.
2. Clock Speed and Performance: Operating at a maximum clock speed of 266 MHz, the MPC8247VRMIBA offers impressive processing power, making it suitable for demanding applications. It also contains a 16 KB instruction cache and a 16 KB data cache, enhancing its overall performance.
3. Memory Interface: The component features a memory management unit (MMU) that supports virtual memory addressing and offers efficient memory management capabilities. It supports various memory types, including SDRAM, DDR, and Flash memory, making it versatile for memory-intensive applications.
4. Communication Interfaces: The MPC8247VRMIBA includes a wide array of communication interfaces, making it suitable for networking and communications applications. It incorporates two 10/100 Mbps Ethernet controllers with integrated physical layers, a PCI interface, USB ports, and serial ports.
5. System Integration: The component provides various integrated peripherals, simplifying system design. It includes a flexible system integration timer module, interrupt controller, DMA controller, and I2C bus interface. These features enable efficient interfacing with other devices and peripherals.
6. Security Features: MPC8247VRMIBA includes security features to protect data and ensure secure communication in applications. It offers an encryption engine that supports DES and Triple DES algorithms for secure data transmission.
7. Low Power Consumption: The MPC8247VRMIBA is designed to be power-efficient, reducing energy consumption and heat dissipation. It incorporates power-saving modes, including sleep and doze modes, which help save power during idle periods.
8. Package and Temperature Range: This IC component is available in a 360-pin Ball Grid Array (BGA) package, which facilitates easy soldering and reliability. It supports an extended temperature range of -40
