The IC component LPC2364FBD100,551 is a powerful microcontroller developed by NXP Semiconductors. It belongs to the LPC2300 series, specifically designed for embedded control applications that require high performance and low power consumption.
Key Features:
1. Core: The LPC2364FBD100,551 operates using a 16/32-bit ARM7TDMI-S processor core, capable of executing instructions at a clock frequency of up to 72 MHz. This core supports Thumb mode, providing enhanced code density and faster interrupt handling.
2. Memory: It contains 128 kB of high-speed Flash memory for storing program code. Additionally, it integrates 16 kB of RAM for data storage purposes. The flash memory can be programmed in-system through various interfaces.
3. Communication Interfaces: It offers multiple communication interfaces, including four UARTs (Universal Asynchronous Receiver-Transmitters), two Fast I2C (Inter-Integrated Circuit) interfaces, two SPI (Serial Peripheral Interface) ports, and one CAN (Controller Area Network) interface. These interfaces enable seamless communication with various peripheral devices.
4. I/O Ports: The chip features 70 general-purpose I/O (GPIO) pins that can be configured for various functionalities. These pins provide flexibility for connecting external components and enable interaction with the microcontroller.
5. Analog and Digital Peripherals: The LPC2364FBD100,551 integrates several analog and digital peripherals to support a wide range of applications. It includes a 10-bit ADC (Analog-to-Digital Converter) with 8 channels, four 32-bit timers, one PWM (Pulse Width Modulation) unit, and multiple digital I/O ports. These peripherals enhance the microcontroller's capability to interface with external components and perform precise control tasks.
6. Power Management: The chip incorporates an efficient power management unit that allows dynamic clock control and multiple power-saving modes, ensuring low power consumption during idle or sleep states. This feature is crucial for battery-operated or energy-conscious applications.
7. Debugging and Programming: To aid in development and debugging, the microcontroller provides an integrated In-System Programming (ISP) and In-Application Programming (IAP) through the on-chip boot-loader software. This enables code updates and debugging without requiring external tools or devices.
8. Package and Temperature Range: The LPC2364FBD100,551 is available in a LQFP100 package, which enhances its versatility and makes it suitable for space-constrained applications. It has a wide industrial temperature range of -40°C to +85°C, ensuring reliable operation in harsh environments.
Overall, the LPC2364FBD100,551 microcontroller offers a rich feature set, combining high-performance computing capabilities with various communication interfaces and versatile peripherals. Its power-saving features and robust design make it an excellent choice for a wide range of embedded control applications.
