MPC8555ECPXALF

IC MPU MPC85XX 667MHZ 783FCPBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
24786C-DS
Manufacturer
Manufacturer Part #
MPC8555ECPXALF

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44 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
783-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerNXP Semiconductors
Integrated Circuits (ICs)Embedded Microprocessors
Product StatusObsolete
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case783-BBGA, FCBGA
Supplier Device Package783-FCPBGA (29x29)
Voltage - I/ O2.5V, 3.3V
Speed667MHz
Core ProcessorPowerPC e500
Number of Cores/ Bus Width1 Core, 32-Bit
Co- Processors/ D S PCommunications; CPM, Security; SEC
R A M ControllersDDR, SDRAM
Graphics AccelerationNo
Ethernet10/100/1000Mbps (2)
U S BUSB 2.0 (1)
Security FeaturesCryptography, Random Number Generator
SeriesMPC85xx
Base Product NumberMPC85
Additional InterfacesDUART, I²C, PCI, SPI, TDM, UART
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN5A002A1 FRE
HTS US8542.31.0001
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The MPC8555ECPXALF is an advanced integrated circuit (IC) component that offers impressive performance and a range of key features. It belongs to the PowerQUICC series of communication processors and is designed by NXP Semiconductors. This IC component is built on the Power Architecture technology, which provides a flexible and scalable solution for various networking applications. It combines high processing power with efficient power management, making it suitable for both performance-driven and power-constrained environments. Here are some key features of the MPC8555ECPXALF: 1. Processing Power: The MPC8555ECPXALF is powered by a PowerPC-based e500 core, which enables high-frequency operation and superior performance. It operates at a clock speed of up to 667 MHz, allowing for swift data processing and execution. 2. Dual Cores: This IC component incorporates dual PowerPC cores, which enables simultaneous execution of multiple tasks. It supports symmetric multiprocessing (SMP), enhancing overall performance and enabling efficient multithreading. 3. Communication Interfaces: The MPC8555ECPXALF offers extensive communication capabilities with a wide range of built-in interfaces. It includes multiple Ethernet ports supporting Gigabit Ethernet, enabling high-speed network connectivity. Additionally, it supports Serial RapidIO (SRIO) and PCI Express (PCIe) interfaces, facilitating efficient data transfer between peripherals. 4. Memory Architecture: It features a flexible memory architecture, supporting various types of memory technologies such as DDR, DDR2, and SDRAM. It allows for high-speed memory access and efficient data manipulation. 5. Advanced Security: The MPC8555ECPXALF incorporates advanced security features to ensure data protection and system integrity. It includes an encryption engine that supports various encryption algorithms, enabling secure communication and data storage. 6. Power Management: NXP has implemented several power management techniques in this IC component to optimize power consumption. It supports dynamic voltage and frequency scaling (DVFS), allowing the processor to adjust its operation based on workload, resulting in power efficiency. 7. Industrial-Grade Reliability: The MPC8555ECPXALF is designed to operate in harsh environments commonly found in industrial applications. It meets stringent requirements for temperature, vibration, and electromagnetic interference, ensuring reliable operation in demanding conditions. 8. Software Support: NXP provides a comprehensive software development kit (SDK) for the MPC8555ECPXALF, enabling developers to quickly build and deploy applications. The SDK includes software libraries, drivers, and tools, making it easier to utilize the processor's capabilities. In summary, the MPC8555ECPXALF is a powerful communication processor with high-speed processing, dual cores, advanced communication interfaces, and robust security features. It is suitable for a wide range of networking applications, including routers, switches, industrial controllers, and telecommunications equipment.

In Stock: 44

MOQ
1PCS
Packaging
783-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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