MPC8360EVVAGDG

The IC component MPC8360EVVAGDG is a highly integrated system-on-chip (SoC) designed by NXP Semiconductors. It offers a wide range of features that make it suitable for various applications in the networking and communications domains. Here is an overview and key features of the MPC8360EVVAGDG: 1. Processor: The MPC8360EVVAGDG is powered by a PowerPC e300 core, which operates at speeds up to 667 MHz. This processor offers high performance and efficient data processing capabilities. 2. Memory: It includes a built-in 32-bit DDR2 memory controller that supports up to 1 GB of DDR2 SDRAM. Additionally, it incorporates a 32 KB instruction cache and 32 KB data cache to enhance overall system performance. 3. Communication Interfaces: The IC component provides an extensive array of communication interfaces, including two Gigabit Ethernet ports with integrated media access control (MAC) and physical layer (PHY) support. It also offers multiple serial communication interfaces like UART, I2C, SPI, and USB. 4. Security Features: The MPC8360EVVAGDG integrates security features to ensure data confidentiality and system integrity. It includes a security engine that supports standards-based encryption algorithms like AES, DES, and Triple DES. Additionally, it offers secure boot capabilities for enhancing system-level security. 5. Peripheral Integration: To enable seamless connectivity with external devices, the component features a comprehensive set of peripheral interfaces. These include multiple PCI and PCIe interfaces, SD/SDIO/MMC interfaces, and general-purpose I/Os. 6. Power Management: The IC component incorporates advanced power management features to optimize energy consumption. It integrates a PowerQUICC system power management controller that enables dynamic frequency scaling, clock gating, and idle power management. 7. System Debug and Development: It offers a JTAG debug interface, which allows developers to perform real-time debugging and software development. This interface is vital in ensuring accurate system monitoring and efficient software development. 8. Availability and Packaging: The MPC8360EVVAGDG is available in a 516-pin lidless ball grid array (BGA) package. Its compact size and robust packaging make it suitable for space-constrained applications. Overall, the MPC8360EVVAGDG IC component from NXP Semiconductors is a highly integrated and feature-rich solution designed for networking and communication applications. Its powerful processor, extensive range of communication interfaces, security features, and peripheral integration make it a suitable choice for various system applications.