MPC8360ECZUAGDG

IC MPU MPC83XX 400MHZ 740TBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
2E6774-DS
Manufacturer
Manufacturer Part #
MPC8360ECZUAGDG

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77 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
740-LBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerNXP Semiconductors
Integrated Circuits (ICs)Embedded Microprocessors
Product StatusObsolete
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case740-LBGA
Supplier Device Package740-TBGA (37.5x37.5)
Voltage - I/ O1.8V, 2.5V, 3.3V
Speed400MHz
Core ProcessorPowerPC e300
Number of Cores/ Bus Width1 Core, 32-Bit
Co- Processors/ D S PCommunications; QUICC Engine, Security; SEC
R A M ControllersDDR, DDR2
Graphics AccelerationNo
Ethernet10/100/1000Mbps (1)
U S BUSB 1.x (1)
Security FeaturesCryptography, Random Number Generator
SeriesMPC83XX
Base Product NumberMPC83
Additional InterfacesDUART, HDLC, I²C, PCI, SPI, UART
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN5A002A1 FRE
HTS US8542.31.0001
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The MPC8360ECZUAGDG is a highly integrated system-on-chip (SoC) semiconductor component manufactured by NXP Semiconductors. This device is part of the PowerQUICC II Pro family and is designed to deliver high-performance processing capabilities for embedded networking and industrial applications. Now, let's explore some of its key features and functionalities. 1. Power Architecture Core: The MPC8360ECZUAGDG is powered by a robust e300 Power Architecture core, which operates at a clock frequency of up to 667 MHz. This high-performance core allows for efficient execution of complex tasks and offers excellent processing power. 2. System Integration: This IC component features an impressive level of integration, combining various functional blocks into a single chip. It incorporates dual e300 cores, integrated communications processors, memory controllers, security engines, and numerous I/O interfaces. Such integration simplifies system design and reduces overall bill of materials. 3. Communications Processors: The MPC8360ECZUAGDG embeds two QUICC Engine processors, which are specifically designed for protocol offloading in communication applications. These processors handle various networking protocols, such as ATM, Ethernet, and HDLC, thereby reducing the burden on the Power Architecture cores. 4. Enhanced Connectivity Options: This component offers a wide range of connectivity interfaces for seamless integration into networking systems. It includes dual Gigabit Ethernet controllers, multiple USB 2.0 ports, PCI interfaces, UARTs, SPI, I2C, and various general-purpose I/Os. These interfaces enable easy connection with external devices and networking peripherals. 5. Memory Subsystem: The MPC8360ECZUAGDG supports a range of memory options, including DDR2, DDR, SRAM, and NOR flash, providing flexibility in designing memory hierarchies that match specific application requirements. It also integrates memory controllers, enhancing memory access efficiency. 6. Security Features: This SoC component emphasizes data security with integrated encryption and decryption engines. It provides hardware acceleration for various encryption algorithms, including DES, 3DES, AES, and SHA-1, protecting sensitive information during communication and storage. 7. Comprehensive Development Tools: To facilitate software development, NXP offers a comprehensive software development kit (SDK) tailored to this component. The SDK provides a variety of tools, libraries, and middleware, helping developers exploit the full potential of the MPC8360ECZUAGDG and reduce time-to-market. In summary, the MPC8360ECZUAGDG is a highly integrated system-on-chip component that combines powerful processing capabilities, extensive connectivity options, advanced security features, and a comprehensive development ecosystem. It is particularly suitable for demanding networking and industrial applications where performance, efficiency, and networking versatility are critical.

In Stock: 77

MOQ
1PCS
Packaging
740-LBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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