MPC8309CVMAFDCA

IC MPU MPC83XX 333MHZ 489BGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
9CAB27-DS
Manufacturer
Manufacturer Part #
MPC8309CVMAFDCA

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2518 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
489-LFBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerNXP Semiconductors
Integrated Circuits (ICs)Embedded Microprocessors
Product StatusActive
Operating Temperature-40°C ~ 105°C (TA)
Package / Case489-LFBGA
Supplier Device Package489-PBGA (19x19)
Voltage - I/ O1.8V, 3.3V
Speed333MHz
Core ProcessorPowerPC e300c3
Number of Cores/ Bus Width1 Core, 32-Bit
Co- Processors/ D S PCommunications; QUICC Engine
R A M ControllersDDR2
Graphics AccelerationNo
Ethernet10/100Mbps (3)
U S BUSB 2.0 (1)

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusREACH is not affected
US ECCNEAR99
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The MPC8309CVMAFDCA is an integrated circuit (IC) component manufactured by NXP Semiconductors. It is a highly integrated system-on-chip (SoC) device that combines a Power Architecture e300 core with various peripherals, making it ideal for embedded applications requiring high processing power and connectivity. Let's delve into the key features and overview of this IC component. Overview: The MPC8309CVMAFDCA is designed to offer outstanding performance and flexibility while reducing overall system costs. It is based on the Power ISA v.2.03 (including an e200z4 core) and operates at a clock frequency of up to 333 MHz. The IC is housed in a 516-pin PBGA (Plastic Ball Grid Array) package, ensuring easy and reliable integration into various electronic devices. Key Features: 1. Power Architecture Core: The e300 core offers enhanced performance, efficient interrupt handling, and a rich set of instruction extensions to support a wide range of applications. 2. External Bus Interface (EBI): The IC combines a 32-bit EBI interface with a flexible memory controller that supports various industry-standard external memory types like SRAM, SDRAM, Flash, and NOR. 3. High-Speed Connectivity: The IC supports a wide range of connectivity options, including three Ethernet controllers (10/100 Mbps), USB 2.0 controller, several UARTs, SPI, I2C, and SDHC interfaces for seamless communication with external devices. 4. Advanced Security Features: The MPC8309CVMAFDCA incorporates various security features like a secure boot controller, cryptographic accelerators, tamper detection, and Random Number Generator (RNG) to ensure data integrity and system-level security. 5. System Integration: The SoC integrates a comprehensive set of peripherals, including an enhanced DMA controller, Interrupt Controller, Universal Serial Interface (USI), Universal Time Management Unit (UMGT), and a range of general-purpose I/O pins, simplifying system design and reducing external component count. 6. Power Management: The IC employs advanced power management techniques, including clock gating and multiple sleep modes, to optimize power consumption, making it suitable for battery-powered or low-power devices. 7. Software Support: NXP provides a comprehensive software development kit (SDK) including Board Support Packages (BSP) and drivers optimized for the MPC8309CVMAFDCA, along with development tools, enabling faster time-to-market and smoother integration. In conclusion, the MPC8309CVMAFDCA is a highly integrated IC component that combines a Power Architecture e300 core with various peripherals, offering high processing power, extensive connectivity, robust security features, and power efficiency. It is an excellent choice for a wide range of embedded applications, including networking equipment, industrial control systems, data acquisition devices, and many more.

In Stock: 2518

MOQ
1PCS
Packaging
489-LFBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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