LFXP15C-4FN256I

IC FPGA 188 I/O 256FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
189536-DS
Manufacturer Part #
LFXP15C-4FN256I

Customer Reference

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44 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-BGA

Quantity

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ManufacturerLattice Semiconductor
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case256-BGA
Supplier Device Package256-FPBGA (17x17)
Voltage - Supply1.71V ~ 3.465V
Number of I/ O188
Number of Logic Elements/ Cells15000
Total R A M Bits331776
SeriesXP
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The LFXP15C-4FN256I is an integrated circuit (IC) component that belongs to the LatticeXP2 family, designed and manufactured by Lattice Semiconductor. It is a powerful field-programmable gate array (FPGA) built with advanced technology, offering a wide range of features and functionality for various applications. Here, we will explore its key features. 1. Programmability: The LFXP15C-4FN256I is programmable, allowing users to configure its digital functions according to their specific requirements. This flexibility makes it suitable for a wide range of applications. 2. Logic Capacity: This IC component offers a significant logic capacity with up to 15,000 look-up tables (LUTs) available. This enables the implementation of complex digital systems and algorithms. 3. High-Speed Performance: The LFXP15C-4FN256I is designed to deliver high-speed performance, making it suitable for applications that require fast data processing. It supports high-speed I/O interfaces, with various protocols like LVCMOS, LVDS, and SSTL. 4. On-Chip Memory: It features on-chip memory resources that can be used for storing data or implementing advanced memory-intensive algorithms. The memory includes built-in block RAMs and distributed RAMs, providing flexibility and reducing the need for external memory components. 5. Flexible I/O Interfaces: The IC component incorporates a wide range of I/O interface options, facilitating connectivity with external devices

In Stock: 44

MOQ
1PCS
Packaging
256-BGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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