LFSCM3GA115EP1-5FFN1152I

IC FPGA 660 I/O 1152FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
8A2FC1-DS
Manufacturer Part #
LFSCM3GA115EP1-5FFN1152I

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

1560 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerLattice Semiconductor
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseOFCBGA-1152
Mounting StyleSMD/SMT
Factory Pack Quantity24

Kindly contact our sales Rep to obtain the data you desire for LFSCM3GA115EP1-5FFN1152I.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The LFSCM3GA115EP1-5FFN1152I is an IC component with various key features designed for use in electronic devices and systems. Here is an overview of its main functionalities and characteristics: 1. IC Component Type: LFSCM3GA115EP1-5FFN1152I is a Field Programmable Gate Array (FPGA) integrated circuit. 2. Density and Logic Elements: It has a logic density of 1152 logic elements (LE). Logic elements are the fundamental building blocks of digital circuits and represent the number of basic logic functions that can be implemented using the FPGA. 3. Speed Grade: This component operates at a speed grade of 5. The speed grade determines the maximum frequency at which the FPGA can operate reliably. 4. Power Supply Voltage: The LFSCM3GA115EP1-5FFN1152I requires a power supply voltage of 1.2V. It is essential to provide a stable and accurate power source within this voltage range. 5. Packaging: This IC component comes in a Fine-Pitch Ball Grid Array (FBGA) package. FBGA packages offer high pin count, excellent thermal dissipation, and compact size. 6. I/O Interfaces: LFSCM3GA115EP1-5FFN1152I features numerous I/O interfaces, enabling connections to external devices, peripherals, and other components

In Stock: 1560

MOQ
1PCS
Packaging
1152-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04
>