LCMXO640E-3FN256C

IC FPGA 159 I/O 256FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
CF2AE0-DS
Manufacturer Part #
LCMXO640E-3FN256C

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2720 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-BGA

Quantity

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ManufacturerLattice Semiconductor
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseFPBGA
Memory TypeSRAM
Number of Macrocells320
Delay Time4.9 ns
Supply Current14 mA
Mounting StyleSMD/SMT
Operating Supply Voltage1.2 V
Maximum Operating Frequency500 MHz
PackagingTray
Factory Pack Quantity450
Minimum Operating Temperature0 C
Maximum Operating Temperature+ 85 C
Number of Programmable I/ Os159
Supply Voltage Max1.26 V
Supply Voltage Min1.14 V

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
LCMXO640E-3FN256C is an Integrated Circuit (IC) component that offers powerful features and functionalities. It is part of the Lattice XO2-640 family, known for its low-power and high-performance characteristics. This IC is designed specifically for applications requiring programmable logic. Key features of the LCMXO640E-3FN256C include: 1. Programmable Logic: The IC component consists of programmable logic cells that can be configured to implement various functions and logic circuits. The LCMXO640E-3FN256C offers 640 Look-Up Tables (LUTs), which can be customized to perform complex operations. 2. Low Power Consumption: Energy efficiency is a crucial aspect of the LCMXO640E-3FN256C. It consumes considerably low power, making it suitable for battery-powered applications and other power-constrained environments. 3. High-Speed Performance: This IC component operates at impressive clock rates, allowing for rapid data processing and execution of logic functions. The high-speed performance is ideal for applications that require quick response times. 4. Small Form Factor: The LCMXO640E-3FN256C comes in a 256-pin FineLine Ball Grid Array (FBGA) package, which provides a compact footprint. This small form factor allows for space-saving integration into various electronic systems. 5. Flexible Configuration: It offers a wide range of I/O options, enabling connectivity to external devices and peripherals

In Stock: 2720

MOQ
1PCS
Packaging
256-BGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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