LCMXO1200C-3BN256C

IC FPGA 211 I/O 256CABGA
part number has RoHS
1 : $23.6700

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Dasenic Part Number
F2A63F-DS
Manufacturer Part #
LCMXO1200C-3BN256C

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1532 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-LFBGA, CSPBGA
Quantity
Unit Price
$ 23.67
Total
$ 23.67

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerLattice Semiconductor
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CasecsBGA-256
Memory TypeSRAM
Number of Macrocells600
Delay Time5.1 ns
Supply Current21 mA
Mounting StyleSMD/SMT
Operating Supply Voltage1.8 V, 2.5 V, 3.3 V
Maximum Operating Frequency420 MHz
PackagingTray
Factory Pack Quantity595
Minimum Operating Temperature0 C
Maximum Operating Temperature+ 85 C
Number of Programmable I/ Os211
Supply Voltage Max3.3 V
Supply Voltage Min1.8 V

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The LCMXO1200C-3BN256C is an IC (integrated circuit) component manufactured by Lattice Semiconductor Corporation. It belongs to the Lattice XO2 series and is specifically designed for applications where low power consumption and high performance are required. Here are some key features of the LCMXO1200C-3BN256C: 1. Programmable logic: The IC features a programmable logic fabric that consists of Look-Up Tables (LUTs) and programmable interconnect resources. This allows for the configuration of digital functions and designs tailored to specific application requirements. 2. Low power consumption: The LCMXO1200C-3BN256C is designed to be highly power-efficient, making it ideal for battery-powered and energy-conscious applications. It offers low static power consumption and supports dynamic power management techniques. 3. High density: Despite its small form factor, the IC offers a high logic density. It features a generous number of logic cells, allowing for the implementation of complex digital systems on a single chip. 4. Advanced packaging: The LCMXO1200C-3BN256C is packaged in a compact 256-ball BGA (Ball Grid Array) package. This form factor ensures good thermal dissipation and facilitates easy integration into space-constrained designs. 5. Built-in features: The IC includes several built-in features that enhance functionality and ease of use

In Stock: 1532

MOQ
1PCS
Packaging
256-LFBGA, CSPBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 23.67
Total
$ 23.67

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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