EP2AGX260FF35C5

IC FPGA 612 I/O 1152FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
906526-DS
Manufacturer
Manufacturer Part #
EP2AGX260FF35C5

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

63 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
Tray Tray Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O612
Number of L A Bs/ C L Bs10260
Number of Logic Elements/ Cells244188
Total R A M Bits12038144
SeriesArria II GX
Base Product NumberEP2AGX260
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for EP2AGX260FF35C5.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGX260FF35C5 is an IC (integrated circuit) component developed by Intel. It is a high-performance FPGA (Field Programmable Gate Array) from the Intel Arria IIGX family. Here is an overview highlighting its key features: 1. FPGA Architecture: The EP2AGX260FF35C5 features a 40 nm manufacturing process and belongs to the Arria II GX series. It offers a robust architecture with abundant logic resources, high-speed transceivers, and embedded memory blocks. 2. Logic Elements: This IC component incorporates 260,000 Logic Elements (LEs), which are the fundamental building blocks of the FPGA. LEs can be combined and configured to create customized digital circuits. 3. DSP Blocks: The EP2AGX260FF35C5 includes 728 Digital Signal Processing (DSP) blocks. These blocks are optimized for performing complex mathematical computations and are ideal for applications requiring high-speed signal processing. 4. Transceivers: With eight high-speed transceivers, this component supports data communication at rates up to 3.125 Gbps. These transceivers offer reliable and efficient transmission of data between FPGAs or external devices. 5. Memory Resources: The device provides 2,657 Kbits of embedded memory, which can be used as RAM or ROM for storing data. Additionally, it supports external memory interfaces like DDR2, DDR3, and QDR-II SRAM

In Stock: 63

MOQ
1PCS
Packaging
Tray Tray Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04
>