EPF10K30RC208-3

IC FPGA 147 I/O 208RQFP
part number has RoHS
1 : $0.0000

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Dasenic Part Number
D64600-DS
Manufacturer
Manufacturer Part #
EPF10K30RC208-3

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84 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
208-BFQFP Exposed Pad

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 70°C (TA)
Mounting TypeSurface Mount
Package / Case208-BFQFP Exposed Pad
Supplier Device Package208-RQFP (28x28)
Voltage - Supply4.75V ~ 5.25V
Number of Gates69000
Number of I/ O147
Number of L A Bs/ C L Bs216
Number of Logic Elements/ Cells1728
Total R A M Bits12288
SeriesFLEX-10K®
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EPF10K30RC208-3 is an integrated circuit (IC) component, specifically a programmable logic device (PLD), manufactured by Altera Corporation. This IC falls under the family of devices known as Field-Programmable Gate Arrays (FPGAs). Here is an overview and key features of EPF10K30RC208-3: 1. Logic Capacity: The EPF10K30RC208-3 offers a logic capacity of 30,000 equivalent system gates, which signifies its ability to implement considerable complexity in digital circuit designs. 2. Package Type: This IC is housed in a 208-pin plastic Quad Flat Pack (PQFP) package, ensuring easy integration into various electronic systems and compatibility with standard IC sockets. 3. Speed Grade: The "-3" suffix in the part number indicates the speed grade of the device. EPF10K30RC208-3 is designed to operate at a moderately fast speed, suitable for a wide range of applications. 4. High-Density Programmable Logic: It provides a versatile and high-density programmable logic architecture. Users can design and implement complex digital circuits by utilizing a vast array of programmable logic blocks, interconnect resources, and embedded memory blocks. 5. Embedded Memory: EPF10K30RC208-3 includes built-in RAM blocks, which can be used for data storage or to implement lookup tables, FIFO buffers, and other memory-based functionalities

In Stock: 84

MOQ
1PCS
Packaging
208-BFQFP Exposed Pad
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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