EP4SGX230KF40I4N

IC FPGA 744 I/O 1517FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
8C7D93-DS
Manufacturer
Manufacturer Part #
EP4SGX230KF40I4N

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77 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FBGA (40x40)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O744
Number of L A Bs/ C L Bs9120
Number of Logic Elements/ Cells228000
Total R A M Bits17544192
SeriesStratix® IV GX
Base Product NumberEP4SGX230
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A7A
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP4SGX230KF40I4N is an integrated circuit (IC) component manufactured by Intel. It belongs to the Stratix IV GX family and is designed for use in high-performance applications. This IC offers a range of features that make it suitable for various demanding applications. One of the key features of the EP4SGX230KF40I4N is its high logic and memory density. It incorporates a large number of programmable logic elements, allowing for complex digital circuitry designs. Additionally, it provides an extensive memory capacity, enabling efficient data storage and retrieval. The IC also supports a wide range of I/O interfaces, allowing for seamless integration with other components and external devices. This includes various high-speed serial interfaces like PCIe, Serial RapidIO, and XAUI, along with multiple LVDS and differential I/O standards, ensuring compatibility with a variety of communication protocols. Furthermore, the EP4SGX230KF40I4N offers exceptional performance capabilities. It operates at a high clock frequency, enabling rapid and efficient processing of data. Additionally, it incorporates advanced DSP blocks, capable of performing complex digital signal processing operations, making it suitable for applications such as image and signal processing. The IC component also includes embedded hard IP modules, such as Ethernet MACs and memory controllers, which provide off-the-shelf functionality and ease of integration. This allows designers to focus on their specific application requirements without the need for writing complex code from scratch

In Stock: 77

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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