EP4SGX180FF35C3N

IC FPGA 564 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
61F5B5-DS
Manufacturer
Manufacturer Part #
EP4SGX180FF35C3N

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738 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseFBGA-1152
SeriesStratix IV GX
Number of I/ Os564
Mounting StyleSMD/SMT
Maximum Operating Frequency600 MHz
PackagingTray
Minimum Operating Temperature0 C
Maximum Operating Temperature+ 70 C
Number of Logic Blocks7030
Embedded Block R A M E B R13627 Kbit

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The EP4SGX180FF35C3N is an advanced IC (Integrated Circuit) component manufactured by Intel, falling under the Stratix IV GX family. It is designed to deliver high-performance and flexibility for a variety of applications such as communication systems, data centers, and high-end computing. Key Features of the EP4SGX180FF35C3N include: 1. FPGA (Field-Programmable Gate Array): The EP4SGX180FF35C3N incorporates a large FPGA with 180,000 logic elements. FPGAs are programmable semiconductor devices that can be customized to perform specific functions. The large logic element count enables complex and resource-intensive algorithms to be implemented efficiently. 2. High-Speed Interfaces: This IC component offers various high-speed interfaces, including 14 transceiver channels with data rates up to 10.3125 Gbps. These interfaces facilitate fast communication between the FPGA and external devices, enabling seamless integration with high-speed data streams and interfaces such as PCIe Gen1/2/3. 3. Low-Power Consumption: The EP4SGX180FF35C3N is designed to be power-efficient, allowing for reduced energy consumption in applications for better overall system efficiency and extended battery life in portable devices. 4. On-Chip Memory: It features a generous amount of on-chip memory, including embedded memory blocks, which facilitate faster data processing and reduce the need for external memory

In Stock: 738

MOQ
1PCS
Packaging
1152-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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