EP4S100G4F45I3N

IC FPGA 781 I/O 1932FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
D7A922-DS
Manufacturer
Manufacturer Part #
EP4S100G4F45I3N

Customer Reference

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1948 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1932-BBGA, FCBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseFBGA-1932
SeriesStratix IV GT
Number of I/ Os781
Mounting StyleSMD/SMT
Maximum Operating Frequency600 MHz
PackagingTray
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Number of Logic Blocks14144
Embedded Block R A M E B R22564 Kbit

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The EP4S100G4F45I3N is an integrated circuit (IC) component, widely used in various electronic devices and systems. It is a complex, high-performance device with several key features that make it a popular choice in the industry. 1. FPGA Technology: The EP4S100G4F45I3N is based on Field-Programmable Gate Array (FPGA) technology. This allows for the reconfiguration of digital circuits and makes it suitable for a wide range of applications. 2. High Density: With 100,000 logic elements (LEs), this IC component offers a high logic density. It can accommodate complex digital designs, providing ample room for advanced functionality. 3. Advanced Process Technology: The EP4S100G4F45I3N is manufactured using advanced process technology, ensuring superior performance, low power consumption, and reliable operation. This makes it suitable for demanding applications that require high-speed processing. 4. High-Speed Interfaces: This IC component supports a variety of high-speed interfaces, including LVDS (Low-Voltage Differential Signaling) and Gigabit Ethernet. These interfaces enable fast data transfer and communication capabilities. 5. Built-in Memory Blocks: The EP4S100G4F45I3N incorporates embedded memory blocks, such as block RAM (BRAM) and FIFO (First-In-First-Out) buffers. These memory resources enhance the versatility and efficiency of the IC component, simplifying the design process

In Stock: 1948

MOQ
1PCS
Packaging
1932-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
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