EP3SL50F780C3N

IC FPGA 488 I/O 780FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
747DA2-DS
Manufacturer
Manufacturer Part #
EP3SL50F780C3N

Customer Reference

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55 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-FBGA (29x29)
Voltage - Supply0.86V ~ 1.15V
Number of I/ O488
Number of L A Bs/ C L Bs1900
Number of Logic Elements/ Cells47500
Total R A M Bits2184192
SeriesStratix® III L
Base Product NumberEP3SL50
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A991D
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP3SL50F780C3N is a programmable IC component from the Altera (now Intel) Stratix III FPGA family. It is a high-performance device designed for a wide range of applications that require advanced processing capabilities. Here's an overview and some of its key features: 1. FPGA Architecture: The EP3SL50F780C3N features a Field-Programmable Gate Array (FPGA) architecture, which allows users to configure the device according to their specific application requirements. The FPGA offers a flexible and scalable solution for designing complex digital systems. 2. Logic Elements: This IC component consists of 49,680 logic elements (LEs) that can be utilized to implement various digital functions such as arithmetic operations, data manipulation, and control logic. The abundance of LEs makes it suitable for designing intricate and feature-rich systems. 3. Embedded Memory: It has a total of 2,622 kilobits (Kb) embedded memory resources, which can be leveraged to store program code, data, or other essential information. The memory blocks can be customized to function as RAM, ROM, FIFO, or shift registers depending on the application requirements. 4. High-Speed Transceivers: The EP3SL50F780C3N incorporates up to 10 high-speed transceiver channels, enabling fast data transmission rates

In Stock: 55

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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