EP2S30F672C3N

IC FPGA 500 I/O 672FBGA
part number has RoHS
1 : $437.8500

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Dasenic Part Number
5CD95C-DS
Manufacturer
Manufacturer Part #
EP2S30F672C3N

Customer Reference

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1695 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
672-BBGA
Quantity
Unit Price
$ 437.85
Total
$ 437.85

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case672-BBGA, FCBGA
Supplier Device Package672-FBGA (27x27)
Voltage - Supply1.15V ~ 1.25V
Number of I/ O500
Number of L A Bs/ C L Bs1694
Number of Logic Elements/ Cells33880
Total R A M Bits1369728
SeriesStratix® II
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
EP2S30F672C3N is an IC component manufactured by Intel. It belongs to the family of Stratix II devices and is specifically designed for high-performance applications. This integrated circuit offers numerous advanced features and functionalities, making it suitable for a wide range of electronic designs. Below is an overview of the key features of the EP2S30F672C3N: 1. FPGA Architecture: The EP2S30F672C3N utilizes Field-Programmable Gate Array (FPGA) architecture, allowing for flexibility and customization of the integrated circuit to meet specific application requirements. 2. High-Speed Performance: With an advanced FPGA fabric, the EP2S30F672C3N provides high-speed performance, capable of handling complex logic and data processing tasks. 3. Large Logic Capacity: This IC component offers a large logic capacity, capable of accommodating extensive and sophisticated designs. It contains 29,440 Logic Elements, making it suitable for applications that demand significant computational resources. 4. Embedded Memory: The EP2S30F672C3N integrates various types of memory, including 19,619 kilobits (Kb) of M4K RAM, which enables efficient data storage and manipulation. 5. High-Speed Transceivers: The IC includes 528 high-speed transceivers, which facilitate high-speed data communication and enable connectivity with other electronic components or systems

In Stock: 1695

MOQ
1PCS
Packaging
672-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 437.85
Total
$ 437.85

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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