EP2AGZ225FF35C4N

IC FPGA 554 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
FB61FE-DS
Manufacturer
Manufacturer Part #
EP2AGZ225FF35C4N

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65 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O554
Number of L A Bs/ C L Bs8960
Number of Logic Elements/ Cells224000
Total R A M Bits14248960
SeriesArria II GZ
Base Product NumberEP2AGZ225
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGZ225FF35C4N is an IC (integrated circuit) component manufactured by Intel Corporation. It is a field-programmable gate array (FPGA) designed to offer high-performance computing capabilities for various applications. Key features of the EP2AGZ225FF35C4N include: 1. FPGA Architecture: The EP2AGZ225FF35C4N is built on Intel's Stratix II GX architecture, which provides a flexible and scalable solution for complex logic designs. It contains a large number of configurable logic blocks, embedded memory, digital signal processing (DSP) blocks, and high-speed transceivers. 2. High-Speed Transceivers: The FPGA is equipped with 4 high-speed transceivers operating at up to 3.125 Gbps. These transceivers support multiple protocols and can be used for high-speed data transmission, including PCIe, Gigabit Ethernet, SATA, and more. 3. Embedded Memory: The EP2AGZ225FF35C4N incorporates various types of embedded memory blocks, including RAM blocks and FIFOs. These memory elements enable efficient data storage and retrieval, enhancing overall performance in data-intensive applications. 4. Power Efficiency: The IC component employs advanced power management techniques to minimize power consumption while maintaining high-performance capabilities. This power efficiency is crucial for optimizing the operation of battery-powered devices or systems with strict power limitations

In Stock: 65

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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