EP2AGX45DF29C4

IC FPGA 364 I/O 780FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
10F299-DS
Manufacturer
Manufacturer Part #
EP2AGX45DF29C4

Customer Reference

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43 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-FBGA (29x29)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O364
Number of L A Bs/ C L Bs1805
Number of Logic Elements/ Cells42959
Total R A M Bits3517440
SeriesArria II GX
Base Product NumberEP2AGX45
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A991D
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGX45DF29C4 is an IC (integrated circuit) component from Intel's Cyclone II FPGA (Field-Programmable Gate Array) series. It is a high-density, high-performance device that can be used in a variety of applications requiring programmable logic solutions. Here are the key features of the EP2AGX45DF29C4: 1. FPGA Architecture: The EP2AGX45DF29C4 is based on the Cyclone II FPGA architecture, which offers a balance between performance, power consumption, and cost-effectiveness. It is built using a 90nm process technology, allowing for increased logic density. 2. Logic Capacity: This IC component provides a significant amount of logic resources, with a logic element capacity of 44,352. Logic elements can be configured as lookup tables, flip-flops, or other user-defined logic functions, allowing for flexible and complex designs. 3. Memory Resources: The EP2AGX45DF29C4 features dedicated memory blocks, including on-chip memory (RAM) and embedded multipliers. It has a total of 648 embedded 9-bit multipliers and up to 324Kbits of RAM available for data storage purposes. 4. I/O Interfaces: The component offers a wide range of I/O options, including high-speed differential and single-ended I/O pins

In Stock: 43

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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