EP2AGX45CU17I3N

IC FPGA 156 I/O 358UBGA
part number has RoHS
1 : $829.3200

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Dasenic Part Number
86D09E-DS
Manufacturer
Manufacturer Part #
EP2AGX45CU17I3N

Customer Reference

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1502 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
358-LFBGA, FCBGA Tray
Quantity
Unit Price
$ 829.32
Total
$ 829.32

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case358-LFBGA, FCBGA
Supplier Device Package358-UBGA, FCBGA (17x17)
Voltage - Supply0.87V ~ 0.93V
Number of I/ O156
Number of L A Bs/ C L Bs1805
Number of Logic Elements/ Cells42959
Total R A M Bits3517440
SeriesArria II GX
Base Product NumberEP2AGX45
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP2AGX45CU17I3N is an Integrated Circuit (IC) component from the Arria II GX family, manufactured by Intel. This IC is built using a 40-nanometer process technology and is designed for various high-performance applications. Key features of the EP2AGX45CU17I3N IC component include: 1. FPGA Architecture: The EP2AGX45CU17I3N is a highly flexible Field-Programmable Gate Array (FPGA) with 49,680 logic elements. This architecture allows users to configure the FPGA according to their specific requirements. 2. High-Speed Serial Transceivers: This IC supports up to 752 high-speed serial transceivers, operating at data rates up to 3.75 Gbps. These transceivers enable efficient communication with external devices and subsystems. 3. Embedded Memory: The EP2AGX45CU17I3N contains 2,955 kilobits of embedded memory, which can be utilized for data storage and processing. The memory blocks can be configured as dual-port RAM, single-port RAM, or FIFO buffers, providing flexibility for different applications. 4. High-Speed Interfaces: It offers various high-speed interfaces, including DDR3 and DDR2 SDRAM memory interfaces, PCI Express (PCIe) Gen1 and Gen2 interfaces, and Gigabit Ethernet interfaces. These interfaces enable seamless connectivity with other components and systems

In Stock: 1502

MOQ
1PCS
Packaging
358-LFBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 829.32
Total
$ 829.32

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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