EP20K1000EBC652-1

IC FPGA 488 I/O 652BGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
5D2341-DS
Manufacturer
Manufacturer Part #
EP20K1000EBC652-1

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50 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
652-BGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case652-BGA
Supplier Device Package652-BGA (45x45)
Voltage - Supply1.71V ~ 1.89V
Number of Gates1772000
Number of I/ O488
Number of L A Bs/ C L Bs3840
Number of Logic Elements/ Cells38400
Total R A M Bits327680
SeriesAPEX-20KE®
Base Product NumberEP20K1000
PackagingTray

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Environmental & Export Classifications
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN3A001A2A
HTS US8542.39.0001
EU RoHS StatusRoHS Compliant
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The EP20K1000EBC652-1 is a highly capable IC (integrated circuit) component developed by Intel Corporation. It belongs to the family of field-programmable gate arrays (FPGAs) and is specifically designed for FPGA-based applications. This overview will discuss key features and specifications of the EP20K1000EBC652-1. 1. FPGA Architecture: The EP20K1000EBC652-1 utilizes a fine-grained FPGA architecture, allowing for high performance and flexibility in a wide range of applications. It consists of programmable logic blocks (LABs), embedded RAM, high-speed I/Os, and other essential components. 2. Logic Capacity: This IC component offers a significant logic capacity of up to 1,008,960 equivalent logic elements (LEs). LEs are the building blocks of programmable logic devices, enabling the implementation of complex digital designs. 3. Embedded RAM: To facilitate data processing and storage within the FPGA, the EP20K1000EBC652-1 integrates 4,608 Kbits of embedded memory. This RAM can be utilized for various purposes like buffering, caching, and data manipulation. 4. High-Speed Interfaces: The IC component supports numerous high-speed I/O standards, including LVDS (low-voltage differential signaling), RSDS (reduced-swing differential signaling), and SSTL (stub-series terminated logic). These interfaces enable efficient data exchange with external devices or systems

In Stock: 50

MOQ
1PCS
Packaging
652-BGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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